Getting started with slow scan television by Glidden R.L.

By Glidden R.L.

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The PDP has units of energy and typical values are measured in picojoules. Therefore, one interpretation is “the energy required to make a decision” and it is desirable to minimize the PDP. The popular use of the PDP as a figure of merit reflects the power–speed trade-off in digital circuitry. For any given circuit, scaling the resistances will tend to provide an even trade-off between speed and power. Doubling the resistances will halve the power but double the propagation delays. Halving the resistances will double the power but halve the propagation delays.

Broadly speaking, integrated circuit packages may be classified as throughhole packages, surface-mount packages, chip-scale packages, bare die, and module assemblies. Through-hole packages have metal pins that may be inserted through holes drilled in the circuit board for soldering. Surface-mount packages utilize metal leads that can be soldered to a single surface of the printed circuit board. Chip-scale packages are only slightly larger than the die they enclose and are attached to circuit boards via an array of solder bumps.

Gates with higher fanin are desirable because they can simplify the implementation and improve the overall performance of complex systems. Practical limits to the fan-in are imposed by device or circuit constraints. However, gates with a fan-in of eight are readily achieved in any logic family. The maximum fan-out (NMAX) is always an integer; it may be limited by static (DC) constraints or by dynamic considerations. The maximum fan-out is usually calculated with the assumption that the load gates are identical to the driving gate.

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